BOSCH

Company will manufacture chips

Bosch plans to start semiconductor production in Dresden ahead of schedule, while expanding the capacity of the “clean” facility in Reutlingen, which will increase from the current 35,000 square meters to over 4,000 square meters in two steps. The first step is to expand the 200mm silicon wafer production area by 1000 m2 to a total of 11,500 m2. In recent months, office space has been converted into “clean” facilities for this purpose and connected to the existing factory via a bridge. Semiconductor production at the new facility has been running since September. The company is therefore primarily responding to the increased demand for MEMS sensors and silicon carbide power semiconductors. In the second stage, an additional 3,000 square meters of “clean” space will be created by the end of 2023. Bosch will invest another 50 million euros here in 2022 and 2023. At the same time, it will create 150 new jobs in semiconductor development in Reutlingen

Another part of the investment planned for 2022 will go to a new semiconductor test center in Penang, Malaysia. The highly automated and interconnected factory will be used to test semiconductor chips and sensors starting in 2023. Bosch has at its disposal more than 100,000 square meters of land on the mainland of Penang, which will be gradually built up. A test center with an area of ​​approximately 14,000 square meters will be built first, including “clean” facilities, offices, research and development, as well as training facilities for up to 400 employees. Earthworks for the new construction began in late 2020. The buildings have been under construction since May 2021. The test center is scheduled to open in 2023. Additional test facilities in Penang are intended to create space for the future placement of new technologies in Bosch semiconductor factories. , for example, silicon carbide semiconductors at Reutlingen. In addition, the new plant in Asia will significantly reduce chip delivery times and shipping distances.

Microelectronics is a crucial success factor for all business areas of the company. Bosch recognized the potential of this technology from the start and has been manufacturing semiconductor components for over 60 years. It is, therefore, one of the few companies that, in addition to know-how in the area of ​​electronics and software, also has deep knowledge in the area of ​​microelectronics. It combines this decisive competitive advantage with its strength in semiconductor manufacturing. The technology and services company has been producing semiconductor components in Reutlingen since 1970. They are also used in the automotive industry and in consumer electronics. Modern electronics in automobiles are the basis for protecting the weather and road traffic accidents, as well as for increasing driving efficiency. “Bosch combines its expertise in the automotive and semiconductor industries and develops state-of-the-art electronic systems. This benefits our customers and the number of people who want to enjoy safe and efficient mobility in the future,” says Harald Kröger, Member of the Board of Management at Bosch. Production at the 300mm silicon wafer plant in Dresden started in July this year – half a year ahead of schedule. The chips manufactured at the new factory are initially used in Bosch power tools. For the needs of the automotive industry, chip production began in September, a quarter of a year ahead of schedule. Since the introduction of 200mm technology in 2010, Bosch has invested over 2.5 billion euros in its chip factories in Reutlingen and Dresden ...“demand for chips is still growing rapidly, especially in the current situation, so we are consistently expanding semiconductor production so that we can provide our customers with the best possible support.”... Said the chairman of the board of Bosch, Dr. Volkmar Denner

Photo source: Bosch