INFINEON

Infineon unveils world's thinnest silicon wafer for AI data centers, measuring just 20 micrometers

Infineon has developed the world's thinnest silicon power wafers, measuring just 20 micrometers in thickness – about the same as a human hair. These wafers promise significant performance gains for power conversion applications across AI data centers, consumer electronics, motor control systems, and computing hardware.

The thinness of silicon wafers is important because it reduces resistance and power loss. Current-gen wafers measure 40 to 60 micrometers thick. By roughly halving the wafer's thickness, Infineon has managed to slash substrate resistance by 50 percent. This, in turn, leads to over 15 percent less power loss compared to other solutions.

These benefits are particularly useful for powering the high-performance AI processors in data center servers. Such chips require voltages to be stepped down from 230V AC to under 1.8V DC, a feat achieved by Infineon's breakthrough technologies, including vertical power delivery.

Reducing silicon thickness to 20 micrometers posed significant technical challenges for Infineon's engineers. The typical metal stack holding the chip on the wafer is actually thicker than the target 20-micrometer thickness, so they had to get creative with an innovative wafer-grinding approach to make it work.

Handling these delicate, paper-thin wafers also presents production challenges, such as wafer bowing and separation issues during the back-end assembly processes. However, Infineon has successfully overcome these obstacles while ensuring that the wafers remain sturdy and robust enough for high-volume manufacturing on existing production lines.

The ultra-thin wafer technology has already been qualified and deployed in Infineon's integrated Smart Power Stages for DC-DC conversion, with the first customers already receiving deliveries. The company expects this energy-efficient design to completely replace existing low-voltage power converter wafers within the next three to four years.

With a strong patent portfolio protecting the wafer innovation, Infineon is establishing a commanding lead in advanced semiconductor manufacturing. Coupled with its silicon, silicon carbide, and gallium nitride portfolios, the ultra-thin wafers position Infineon at the forefront of key decarbonization and digitalization technologies.

"The new ultra-thin wafer technology drives our ambition to power different AI server configurations from grid to core in the most energy-efficient way," said Adam White, president of power & sensor systems at Infineon. "As energy demand for AI data centers is rising significantly, energy efficiency gains more and more importance. For Infineon, this is a fast-growing business opportunity. With mid-double-digit growth rates, we expect our AI business to reach one billion euros within the next two years."

If you want to check out the world's slimmest silicon wafers in person, Infineon will be showing them off at the Electronica trade show in Munich running November 12-15.

mundophone