UNISOC

Shanghai Unisoc has announced the T750 mobile platform, made in accordance with the standards of 6nm technology process. The main innovation is the built-in 5G cellular modem.
This is an entry-level chipset, and its use will significantly reduce the cost of smartphones for 5th generation networks.
The new Unisoc T750 chipset combines two 2GHz Cotrex-A76 cores and six 1.8GHz Cortex-A55 cores. For graphics processing is responsible for a Mali-G57 dual-core gas video pedal. The single chip system supports LPDDR4X RAM and UFS 3.1 flash drives. It also claims to support Full HD+ 90Hz displays and optical sensors with a resolution of up to 64 MP. This chip is designed for the most affordable smartphones.
by: mundophone
No comments:
Post a Comment