SAMSUNG

South Korean giant will use new technology to produce 2nm chips

Samsung plans to use a technology called the Back Side Power Delivery Network (BSPDN) in its manufacturing process for its 2nm chips. This technology was presented last week by researcher Park Byung-jae at the SEDEX 2022 conference hosted by Samsung.

Technically, BSPDN does not change the way transistors are placed on a chip, but it is an evolution of the chiplet design used by Samsung, Intel, and TSMC, and it is an evolution of technologies like FinFET, GAA, and MBCFET.

BSPDN allows you to create complex systems on a chip (SoC), which can include multiple chips from different companies, manufactured using different technological processes.

Another advantage of BSPDN technology is the ability to create so-called 3D-SoCs - chipsets in which logic elements are combined with memory. BSPDN technology also allows you to place a conductive layer under the silicon and use the top layer (FSPDN) for control and power signals.

According to preliminary calculations, chips made with the new BSPDN technology will perform 44% more and consume 30% less power than Samsung's current 3nm GAA chips.

mundophone