SONY
The new version of the PlayStation 5 gaming console with model number CFI-1202 received a new custom hybrid processor, codenamed Oberon Plus, reports Angstronomics. The chip uses a thinner manufacturing process, making it smaller than its predecessor Oberon.
According to the source, Sony's new game consoles now use a more compact processor, manufactured at TSMC's facility using more advanced 6nm process technology. Recall that the original decoder was produced with the Oberon processor, which uses 7nm TSMC N7 process technology.
Architecturally, the new chip has not changed at all. It still uses AMD Zen 2 compute cores and RDNA 2 graphics architecture. Performance remains the same. The matrix area of the new processor is about 260 mm2. For comparison, the original version has a chip area of 300 mm2.
The fact that Sony has released a new version of the PlayStation 5, became known earlier this month. The manufacturer has completely redesigned its internal components. The new version received a smaller motherboard, as well as a more compact and lightweight cooling system. The use of the latter became possible precisely due to the transition from the set-top box processor to a new thinner process technology. As noted in an early review of the new version, the updated console requires less power and is therefore less demanding on cooling.
The release of smaller chips for the PlayStation 5 means more chips can be built on a single silicon wafer. So, theoretically, an upgraded console could cost up to 12% less to manufacture.
According to Angstronomics, Microsoft is also looking to move to smaller processors in its Xbox Series S and X game consoles in the near future.
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