AMD

AMD boss to discuss semiconductor manufacturing with 2nm and 3nm process technology with TSMC

AMD CEO Lisa Su is scheduled to visit Taiwan between late September and early November to discuss cooperation with local partners, along with several other senior company executives. AMD management will negotiate with TSMC as well as chip packers and major PC manufacturers.

During the visit, Ms. Su will meet with the head of TSMC and privately discuss with him the operation of the N3P (3nm process technology) and N2 (2nm process technology) production lines, DigiTimes reports citing its own sources. Company executives will discuss upcoming orders using existing or future technologies.

AMD's success in the processor market in recent years is due, among other things, to TSMC's ability to produce high-end products in large quantities. AMD needs timely access to processor design kits (PDKs) to capitalize on its success. TSMC will launch mass production on N2 nodes in the second half of 2025, so AMD needs to negotiate now to introduce the technology into products in 2026.

In addition to advanced semiconductor manufacturing technologies, AMD's success will also depend on packaging solutions – the company will continue to develop CPU and GPU from multiple crystals (chiplets). Today, AMD already uses several innovative solutions, but in the future, the need for different packaging technologies will only increase, and it will be necessary to negotiate production capacities and prices in advance. PCBs and substrates will be discussed with Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology. Finally, AMD executives will meet with ASUS and Acer, Taiwan's largest PC makers and longtime partners, as well as chipset developer ASMedia.

Image source: amd.com