REALME

The brand's GT 2 line will receive an exclusive refrigeration system with a steam chamber

Realme will unveil the GT 2 family of flagship smartphones next Tuesday, January 4th. Despite the imminent launch, the company continues to share details about upcoming new products, about which much is already known. Today's batch of teasers talks about the features of the GT 2's cooling system.

Realme reports that GT 2 series smartphones, based on the latest Qualcomm Snapdragon 8 Gen 1 chipset, will receive the industry's largest heat dissipation board with an enlarged vapor chamber. The slab area will reach 36,761 mm². Thanks to this, new products will be able to demonstrate the highest performance, even under prolonged high loads, typical for use cases like demanding online games.

One of the teaser screenshots says that Realme will introduce a new GT Mode 3.0 game mode for its future flagships, which will allow you to “pull” maximum performance from the GPU. Realme has also officially confirmed that the GT 2's flagships will receive the Snapdragon 8 Gen 1 chipset, which is not a big surprise.

At the January 4th event, Realme is scheduled to showcase three smartphones: the Basic Realme GT 2, the Realme GT 2 Pro Master Edition and the Realme GT 2 Pro camera.

Image source: Realme