TECH

Leaker reveals technical specifications of MediaTek's Dimensity 8400 chipset

MediaTek is expected to announce a less-powerful version of the Dimensity 9400 which should arrive as the Dimensity 8400. Now, a leak has revealed details of its CPU and GPU and they hint at a significant improvement in performance.

MediaTek already unveiled its flagship chipset, the Dimensity 9400, and it has already appeared in a handful of smartphones such as the Oppo Find X8 and Find X8 Pro. As is the tradition, there will be a less powerful variant of the processor which is expected to be called the Dimensity 8400. MediaTek is yet to unveil it but there have been multiple reports about it, with the latest revealing details about the CPU and GPU.

The Dimensity 8400 will be an octa-core CPU with a 1+3+4 CPU architecture according to a post on Weibo by Digital Chat Station. The post also revealed that the 4nm chipset, which will be produced by TSMC, will feature Arm's Cortex-A725 cores. However, in a reply to a question in the comments of the post he clarified that the Dimensity 8400 will actually have four Cortex-A725 cores and four Cortex-A720 cores.

One of the Cortex-A725 cores will be overclocked with a clockspeed of over 3GHz while the remaining three Cortex-A725 cores will have a lower clockspeed but also in the 3GHz range. The Cortex-A720 premium efficiency cores, which replace the Cortex-A510 of the Dimensity 8300 inside the Poco X6 Pro (curr. available on Amazon.de for €295), will have a 2.xGHz clockspeed.

For its GPU, the Dimensity 8400 is reported to use the same GPU IP as the Dimensity 9400 which is the Arm Immortalis-G925. However, it is not known if it will have the same number of cores. The source does mention that the performance of the chipset is still being optimized.

There are guesses as to which manufacturer will be the first to announce a phone powered by the Dimensity 8400. There are suggestions that it may be one of the Redmi K80 models while some say it might be one of the models in the upcoming Oppo Reno 13 series. More details should surface in the coming weeks.

Kirin 9100 specs revealed: 6 nm chip tipped to launch with a Cortex-X1 prime core...A new leak has revealed important specifications of Huawei's upcoming Kirin 9100. It comes with an 8-core CPU manufactured on SMIC's N+3 (6 nm) node. For the GPU, it will use an in-house Maleoon 910 GPU from last year.

Rumours about Huawei's new SoC have been picking up steam ahead of the Mate 70 series' launch. While some have been pure fluff made up by Chinese netizens, others paint a more accurate picture. A Telegram user who goes by @spektykles has now revealed what look like the Kirin 9100's official specifications.

The chip is codenamed HiSilicon Baltimore and it comes with an 8-core CPU with 1x Cortex-X1 (2.67 GHz), 3x Cortex-A78 (2.32 GHz) and 4x Cortex-A55 (2.02 GHz). It is restricted to Arm v8 (and older CPU cores) due to ongoing sanctions. For the GPU, it uses a Maleoon 910, presumably the same one found on last-year's Kirin 9010.

Performance-wise, the Kirin 9100 will trade blows with the Snapdragon 8 Gen 2 in CPU and Snapdragon 8+ Gen 1 in GPU. It will be manufactured on SMIC's N+3 node (6 nm) and not 5 nm as previously rumoured. This will result in a bump in power-efficiency (between Snapdragon 8 Gen 3 and Gen 2). It is a bit too early to estimate its benchmark numbers, but a leak from earlier this year said it scores around 1.1 million points in AnTuTu.

mundophone