TSMC
TSMC will begin mass production of 3nm (N3) chips next month, according to the Commercial Times. Deliveries to TSMC customers of the first products based on the N3 process are expected early next year.
Typically, TSMC starts mass production of new process technologies in the spring to produce enough chips in time for Apple's new iPhone models, which are usually released in September. However, the development of the N3 node took longer than usual. That's why Apple will use a different process technology in future smartphones. Despite this, Apple will be the first TSMC customer to receive chips made with 3nm process technology.
Compared with 5nm N5 technology, N3 technology will increase frequencies by 10-15% while keeping the same level of power consumption, or reduce the power consumption of crystals by 25-30% while maintaining the frequency. In addition, new production standards will allow increasing the density of transistors on a chip by about 1.6 times.
One of the main features of the N3 node is FinFlex technology, which is expected to increase the attractiveness of the company's chips to customers. The essence of the technology is that the manufacturer will allow the use of different types of FinFET transistors within a single semiconductor crystal. The technology can benefit complex products such as CPUs and GPUs. Therefore, Apple, AMD, Intel and NVIDIA will be able to release more productive solutions for certain computing tasks.
In the future, TSMC will release N3E, N3P and N3S process technologies. The former will be N3 optimizations and the latter two will be N3E optimizations for various classes of applications. N3P focuses on high performance chips while N3S focuses on energy efficient chips with higher transistor density. Both processes are scheduled to launch in 2024, with N3E arriving in 2023.
mundophone
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