Friday, September 18, 2026


TECH


Will AI Graduate from Tool to Lab Member? A Q&A with John Tsang

John Tsang, PhD, and his Yale lab members Jacob Kim and Ao Huang recently posed the question of whether AI immunologists are ready for prime time. Specifically, they were referring to large language models (LLMs) and whether they are as creative as humans in developing new hypotheses and methods for research in the field of immunology.

The answer, based on current studies, is no, not yet, says Tsang, Anthony N. Brady Professor of Immunobiology and professor of biomedical engineering at Yale School of Medicine. While there are functions where AI can be effective, such as summarizing relevant literature, LLMs like ChatGPT aren’t able to consistently generate truly original hypotheses, scientific ideas, or experimental approaches.

But, Tsang adds, researchers are exploring new ways of engaging LLMs that could overcome these current hurdles.

“I think there is a future—probably not too distant—where AI will be able to do such things,” says Tsang, founding director of the Yale Center for Systems and Engineering Immunology and an investigator with and the Yale lead for Biohub New York. “I see AI one day being a sort of team member, contributing ideas alongside scientists.”

We spoke to Tsang about the current state of what he calls AI immunologists and where he sees opportunities going forward.

John Tsang, PhD: An AI immunologist isn’t yet a robot that goes into the lab and does experiments. It’s an AI system that can think through concepts, propose hypotheses, suggest experiments, and interpret the data that come out of those experiments. That’s the kind of AI immunologist we’re talking about.

What do you mean when you refer to AI immunologists?

John Tsang, PhD: An AI immunologist isn’t yet a robot that goes into the lab and does experiments. It’s an AI system that can think through concepts, propose hypotheses, suggest experiments, and interpret the data that come out of those experiments. That’s the kind of AI immunologist we’re talking about.

How is AI capable in that regard now? What can it do well?

Tsang: What it can do really well is research the literature. For example, if you ask, “What's known about this molecule? What can that molecule do to this kind of cell?” AI can deliver excellent information. Basically, if you talk to any of these AI chatbots, things like Claude, Gemini, and ChatGPT, they're doing very well in this regard these days.

And where does AI still have room for improvement?

Tsang: AI is still not super effective at coming up with things that may be novel in the sense that AI may not be completely taking into account, for example, information from another field. If you don't prompt the AI and say, “Hey, have you thought about this particular knowledge in biochemistry or this particular thing over in aging? Do you think there's a connection between that and this principle?” it doesn’t do that on its own.

You note there are exciting opportunities when it comes to multi-agent approaches. Can you describe what these approaches are?

Tsang: When using AI in a classical way, you have one agent, and you have an interactive discussion with it. With a multi-agent approach, as a few research groups have now described, you ask different independent bots to take different roles. One bot could be a computational biologist, another one could be a biochemist, and yet another one could be someone who knows a lot about antibodies, for example. And then there's also a human who's involved in the team that can give the bots a high-level task and then let them talk to each other.

What is very interesting is that in examples of this type of approach so far, the majority of the interactions happen among the AI bots. The human doesn't necessarily go in and tell them what do. And researchers have found that the bots are capable of coming up with a work plan and executing it. Even when the human, while part of the team, is not doing the major coordination.

So that is quite interesting, suggesting that by having interactions among these bots—and I think the key is that they take on different roles—they are able to start to generate something that's quite emergent, not just straight answering. They can engage a multi-step plan and make decisions based on the data. That is, I think, quite intriguing.

One striking example is “The Virtual Lab,” a system developed by Biohub colleagues in which an AI principal investigator led a team of AI specialists—an immunologist, a computational biologist, and a machine learning expert—to design nanobodies (small antibody-like molecules) against a new SARS-CoV-2 variant. The team produced 92 candidate designs, and two were experimentally confirmed to bind the new variant. Notably, more than 98% of the words exchanged during the project came from the AI agents themselves; the human researcher set the goal and stayed in the loop, but the bulk of the back-and-forth largely happened among AI agents.

Would this type of approach help overcome some of the current limitations of AI?

Tsang: Yes, I think so. And I think it also overcomes what's called a context window problem. So each bot has a certain memory, and when you have a team like that, the total volume of memory becomes quite large. At the same time, the bots can start to write out answers to external files, which can get pulled back in again, extending memory further, in a way.

Another interesting thing that's emerging is what's called “world models.” So these are agents that have a much longer memory span, so they're not just working within this context window. They have external storage, and they try to provide a model of the world that the particular agent is in. I think that's also going to help.

Where do you think is the greatest potential when it comes to AI and immunology?

Tsang: I think the answer lies on two levels. First, I think it's going to be helpful in proposing and hypothesizing things that we haven't thought of yet. However, that will be based on existing data, and we still have limited data on lots of things in immunology.

For example, one project that I co-lead called the Human Immunome Project aims to capture human immunology variation across different people and across different populations. Now that kind of data simply doesn't exist yet. If you ask a chat bot or even multi-agents and say, "I know this vaccine works in the U.S. with this level of efficacy, what happens if I bring it to Tanzania?" it would have no idea because it simply doesn't have enough information and knowledge yet.

So that's where a different kind of AI, models like quantitative models of the human immune system, come in. That's another area that we are actively working on, how to develop that kind of model. Of course, once such models become available and useful, then AI agents can use them to query and answer the questions we ask.

Additionally, AI agents, I think, could form a team with us to work together on that problem, where we need to design experiments. We need to think about, given a certain number of resources and budget, what's the best first experiment, for example, what's the best first data collection exercise? Those are the kind of things that we are thinking about a lot.

How do these AI technologies intersect with education?

Tsang: I think we need to put these into education fairly quickly so students can understand how to use them and feel comfortable doing so. Plus, there are creative aspects, like the multi-agents and how to put them together.

I personally use these tools, especially when I’m starting something new. I want to get a sense of what’s known and also to potentially make novel connections. And my lab has discussed this sort of AI team approach.

Sometimes I think there's a bit of a worry about using AI to cheat, for example. That's what some educators may be thinking. But I think we have an opportunity to promote positive and productive use. And so the question is how to incorporate this technology in the most positive, effective way possible.

by: Mallory Locklear, PhD--Managing Editor—Science, Research, and Education


TECH


GrapheneOS says Google is keeping new Android 17 security features from other phones

The Android smartphone world often prides itself on its open-source nature, but the rules of the game appear to be changing drastically. GrapheneOS, a renowned privacy-focused ROM, has leveled harsh criticism at Google regarding the operating system's latest update.

At issue is the release of the new Android 17 QPR1, which began rolling out in mid-September alongside the Pixel Drop package. According to the project's developers, the search giant is intentionally blocking access to crucial features and security fixes within the AOSP (Android Open Source Project). This stance creates a massive gap between Pixel devices and the rest of the ecosystem, delaying improvements for other brands by months. It is, to say the least, concerning to see the company that founded Android increasingly closing the door on community developers.

The team behind GrapheneOS did not mince words when analyzing the inner workings of this new version. They claim Google intentionally withheld new developer APIs and security patches, keeping them exclusive to its own Pixel smartphones.

The major issue is that partner manufacturers and custom ROM creators are effectively left with their hands tied until December, when the code is expected to finally be released to AOSP with the arrival of Android 17 QPR2. This means millions of users on other brands remain exposed to vulnerabilities that Google has already patched on its own devices—raising serious ethical questions.

To understand the gravity of the situation, here are the key technical points raised by the security team:

Critical vulnerability fixes included in the September Pixel bulletin were not integrated into the general Android security bulletin.

New APIs essential for developers are restricted and completely out of reach for third parties.

Deep system changes force community projects to resort to reverse engineering in order to adapt the software in time. This is the first time since the days of the old Android Honeycomb that a version has introduced new APIs without simultaneously sharing them via AOSP.

GrapheneOS—which had already begun moving away from Google hardware to form a more transparent development alliance with Motorola—views this situation as a clear-cut anti-competitive move. It is hard to disagree when one considers the obvious imbalance this creates in the current mobile market.

For now, the development team reports that while they have managed to adapt much of their code for the new Android 17 QPR1, they lack the legal authorization to officially distribute it. Their workaround has been to port firmware, drivers, and other technical components from the Pixel directly to the standard Android 17 base—a genuine engineering puzzle.

It remains to be seen whether Google will maintain this strategy of distancing itself in the coming years or if community pressure will force a change in direction. One thing is certain: the promise of an Android platform that is perfectly uniform and open to everyone is gradually becoming a mirage, accessible only to those who invest in a Pixel.

GrapheneOS has accused Google of deliberately withholding crucial APIs and Security fixes from AOSP in the Android 17 QPR1 update. The decision affects Android manufacturers, with the new security measures potentially never arriving on phones other than Google Pixel devices.

GrapheneOS on X explaining lacklustre Android 17 QPR1 security APIs

Google Is Withholding AOSP code...According to GrapheneOS, Android 17 QPR1 marks the first time since Android Honeycomb that Google has introduced new developer APIs without simultaneously publishing the corresponding code to AOSP.

This means that the new APIs that promote better privacy and security can never be implemented on other Android smartphones, as Google has officially made them exclusive.

The GrapheneOS team stated they had their code ported prior to the September 15, 2026 release but currently lack permission to publish it. The complaint arrives on top of developers already being forced into the tedious process of backporting Pixel firmware, userspace drivers, and HALs directly to the older Android 17 framework.

This is because Google has essentially stopped publishing device trees, source code and binaries for Pixel phones, essentially attempting to kill third-party custom ROM support.

However, projects like Graphene and LineageOS have held on, albeit still limited to the Pixel 9 series. As a result of this change, even a year after the Pixel 10's launch, the phones are still not supported by the LineageOS team. 

GrapheneOS calling out Google for dubious practices

Critical security repercussions...The accusations also extend to critical device safety. The September 2026 Pixel Update Bulletin mentions several vulnerability fixes that are conspicuously missing from the standard Android Security Bulletin.

GrapheneOS claims that many of these fixes apply to core platform components used by non-Pixel devices. By holding these ecosystem-wide patches back until the Android 17 QPR2 release in December, Google is giving its Pixel hardware an exclusive security advantage over other Android OEMs.

While GrapheneOS acknowledges that Pixels are still useful for their project due to their baseline security features, they warn that Google's new strategy makes supporting the devices significantly more difficult.

That said, with the upcoming GrapheneOS-Motorola partnership, the project expects its upcoming collaboration to streamline software development, as that partnership will provide direct access to official firmware and driver code.

This is clearly not a good outlook on Google's part, especially considering how the company doesn't hesitate to market Android security and privacy. If anything, these actions suggest otherwise, and delaying new security APIs and features is quite contradictory.

mundophone

Thursday, September 17, 2026


APPLE


iPhone 18 Pro battery life disappoints vs iPhone 17 Pro in gaming

Thanks to bigger batteries and the more power-efficient Apple A20 Pro SoC, Apple promises some excellent battery life gains for the iPhone 18 Pro and the iPhone 18 Pro Max. However, Dave2D shows that the battery life improvements aren't as impressive as some might've imagined.

Apple makes some bold claims regarding the battery life of the iPhone 18 Pro and the iPhone 18 Pro Max. Apple officially claims 45 hours of video playback for the eSIM-only iPhone 18 Pro Max and 36 hours for the iPhone 18 Pro. While Apple doesn’t officially advertise the battery capacities, reports suggest that the eSIM-only iPhone 18 Pro and the iPhone 18 Pro Max carry a 4,288 mAh and 5,567 mAh battery, respectively.

However, despite packing larger batteries and a more efficient A20 Pro SoC, Dave2D shows that the battery life gain in demanding use cases remains small for the iPhone 18 Pro Max and non-existent for the iPhone 18 Pro.

The YouTuber reports that, in Genshin Impact at 600 nits of screen brightness, the Apple iPhone 18 Pro Max only lasted 23 minutes longer than the iPhone 17 Pro Max. So, the 9.4% bigger battery is undoubtedly helping here.

The battery life improvement was much more noticeable in lighter routine usage, as the iPhone 18 Pro Max lasted for 17 hours and 19 minutes while browsing Reddit at 600 nits. The iPhone 17 Pro Max lasted for 15 hours and 36 minutes in the same scenario.

The iPhone 18 Pro and the iPhone 17 Pro have roughly identical battery capacities, as there is only a 36 mAh difference between the two. So, any battery life improvements we see on the iPhone 18 Pro will primarily come down to the efficiency gains provided by the Apple A20 Pro.

Coming in at 14 hours and 27 minutes, the iPhone 18 Pro lasted almost an hour longer than the iPhone 17 Pro in Dave2D’s Reddit loop test. However, the iPhone 18 Pro actually fell behind the iPhone 17 Pro while playing Genshin Impact, as the iPhone 18 Pro's battery life was 11 minutes shorter.

In short, the battery life upgrades enjoyed by the new iPhone 18 Pro and 18 Pro Max don’t seem to be that big. So, you might be disappointed if you were hoping for much better battery life.

iPhone 18 Pro battery numbers are both good and bad news for Samsung...Apple announced the iPhone 18 Pro and iPhone 18 Pro Max last week, and it had plenty to say about them. The company doesn’t traditionally share battery capacity, though, but a regulatory source has now revealed these details and more.

The European Union’s EPREL database has revealed that the iPhone 18 Pro has a 4,056mAh battery, a negligible upgrade over the iPhone 17 Pro’s 3,988mAh battery. On the other hand, the iPhone 18 Pro Max is listed with a 5,391mAh battery, which is a significant upgrade over the iPhone 17 Pro Max’s 4,823mAh battery.

It’s worth noting that global iPhones usually have slightly smaller batteries than US models, as the global variants still offer physical SIM slots. For example, the iPhone 17 Pro has a 4,252mAh battery in the US, while the Pro Max has a 5,088mAh battery. So don’t be surprised if the iPhone 18 Pro and Pro Max have even larger batteries in the US than the EU’s database indicates.

Apple is also banking on the 2nm A20 Pro chip to deliver plenty of efficiency gains across both models. Nevertheless, it’s clear that the iPhone 18 Pro Max is probably the one to get if you want the longest battery life possible in an iPhone. It also has a bigger battery than all recent Galaxy flagships. However, many other Android brands are now using 7,000mAh, 8,000mAh, or even 10,000mAh silicon-carbon batteries in their phones for even longer endurance.

The EPREL database also reveals disappointing news if you were hoping for better long-term battery health. The iPhone 18 Pro series offers 1,000 charging cycles before reaching an effective 80% capacity. This means you’ll basically lose 20% of your battery’s capacity after roughly three years. That’s in line with recent iPhones and Pixel phones, but short of rival devices like the Samsung Galaxy S26 series (1,200 cycles), Motorola Edge 70 Pro (1,200), OnePlus 15 (1,100 to 1,400), and Xiaomi 17 series (1,600).

There is good news for charging times, though. Xiaobai’s Tech Reviews (h/t: Ice Universe) reports that the iPhone 18 Pro Max in particular is the fastest-charging iPhone ever. It can apparently reach 100% in 55 minutes, with a peak speed of 52W. There are faster-charging Android phones out there, but this seems a little faster than the Pixel 11 Pro XL.

mundophone


TECH


Heat directly converted to cooling in electricity-free refrigeration

Motor-free refrigeration...The basic cooling principle used in refrigerators, air conditioning systems, and data centers has remained unchanged for over a century: an electric-powered compressor transfers heat—carried by a refrigerant fluid—from one location to another. As the demand for cooling constantly rises, heating and cooling currently account for nearly half of global energy consumption.

So, what if we replaced the electric motors used in these cooling technologies with heat itself?

This is precisely the concept being tested by Yi-Ting Hsiau and colleagues from the Karlsruhe Institute of Technology (Germany) and the University of Tsukuba (Japan).

Two ultra-thin films made of a special metal alloy—known as a shape-memory alloy, the same type used in artificial muscles—interact to convert thermal energy into mechanical work, a task currently performed by electric motors. This mechanical work is then converted into cooling.

Beyond saving energy, this interaction opens up new possibilities for waste heat recovery and the use of solar energy in solid-state cooling systems.

The proof-of-concept prototype features two ultra-thin nickel-titanium films that perform complementary functions.

The first film utilizes the shape-memory effect: upon heating, it begins to contract, converting thermal energy directly into mechanical work without the need for an electric motor. This movement is immediately transferred to the second film, where cyclic loading and unloading induce reversible changes in the metal's crystal structure, generating cooling.

In this way, heat replaces the electric actuator previously used in elastocaloric cooling systems.

"The crucial innovation lies in combining two complementary functions of shape-memory alloys: one film converts heat into mechanical work, and the other converts that work into cooling," explained Professor Jingyuan Xu. Thus, we have established a new approach to solid-state cooling, opening up interesting possibilities for harnessing waste heat and solar energy.

Cooling and heating account for nearly half of global energy demand1, and the ongoing miniaturization of electronic and photonic devices makes efficient thermal management increasingly critical. Vapour compression cooling dominates the market, but its reliance on high global warming potential refrigerants accounts for more than 40% of global energy-related CO2 emissions2 and its bulky components, such as compressors, make it incompatible with miniaturized systems. Thermoelectric devices have been widely deployed to address the demand for miniaturized cooling3, but their efficiency is only 10–15% of the theoretical reversed Carnot limit, roughly one-quarter that of modern vapour compression systems4, which greatly constrains their applicability. Elastocaloric cooling, driven by stress-induced martensitic transformations in shape memory alloys (SMAs) or crystallization transitions in polymers, has emerged as the most promising alternative9,10, eliminating volatile refrigerants and offering theoretical efficiencies of up to 84% of the Carnot limit11.

Most recent research on elastocaloric cooling has focused on bulk SMA geometries for macroscale applications, such as SMA tubes, which are coupled with heat-transfer fluids and regenerator designs to achieve high cooling power and a large temperature span. Macroscale elastocaloric devices have already demonstrated temperature spans of up to 75 K and 1,284 W cooling power at zero temperature lift. By contrast, for miniature-scale cooling, film geometries offer promising prospects: their small mass and large surface-to-volume ratio enhance heat transfer, enabling higher cycling frequencies (for example, 4 Hz) and a high specific cooling power (SCP) of up to 19 W g−1. Moreover, film-based elastocaloric devices can avoid the use of heat-transfer fluids by employing solid-to-solid mechanical contact for heat exchange17,18, minimizing system complexity and allowing operation in confined spaces. To further enhance performance, cascading can increase the temperature span, while parallelization boosts cooling power, together enabling device upscaling for higher overall output.

Currently, however, elastocaloric cooling prototypes typically rely on electrically powered actuators, making them electricity-dependent systems that continue to incur indirect CO2 emissions during operation as most electricity is still generated from fossil fuels. In addition, current devices typically use electromechanical motors or hydraulic actuators as drivetrains to generate the large forces required to load superelastic SMA refrigerants. However, high-force actuators are commonly designed for long stroke operation, resulting in relatively low force/displacement ratios (defined here as the ratio between maximum output force and stroke length). In contrast, superelastic SMA refrigerants require stresses on the order of several hundred megapascals while undergoing strain of only a few percent, thereby demanding a high force over limited displacement and corresponding to a high force/displacement ratio. This mismatch in actuator–refrigerant mechanical characteristics, together with the substantial mass of conventional drivetrains relative to thin-film refrigerants, leads to inefficient drivetrain utilization and oversized actuation systems26,27. A key challenge, therefore, is to develop elastocaloric cooling systems that minimize electricity dependence while employing mechanically well-matched actuators.

In this work, we developed a film-based, heat-driven elastocaloric cooling prototype by integrating thermally powered shape memory actuator films with superelastic SMA refrigerant films, offering the potential to harness low-temperature heat sources, such as waste heat, to deliver electricity-free cooling. The SMA-based thermal actuator provides an improved force/displacement ratio of 14.5 N mm−1, compared with 1.1 N mm−1 for the commercial electromechanical actuator used in this study (Supplementary Note 1), as a result of the intrinsic shape recovery behaviour of high-temperature SMAs, which enables high force generation over a limited stroke without bulky transmission systems. While a regenerative heat-driven elastocaloric concept has been proposed through thermodynamic modelling and numerical simulations at the macroscopic scale26, in this study, we experimentally realized thermally powered shape memory actuation directly coupled with a thin-film elastocaloric refrigerant architecture at miniature scale. The integrated prototype achieves a temperature span of 12.9 K at the material level and 4.0 K at the device level under Joule-heated thermal actuation at 86 °C. Operation driven by an external heat source was further validated, achieving a device-level temperature span of 2.2 K. This approach addresses the key limitations of electrically driven systems and illustrates the feasibility of using thermal energy as the driving source for thin-film solid-state elastocaloric cooling.

Construction of a heat-driven elastocaloric cooling system...Our prototype integrates two mechanically coupled units: a thermal actuation unit and a cooling unit (Fig. 1a). Thin-film SMAs were chosen for their high surface-to-volume ratio, which promotes rapid heat transfer and enables efficient cycling. The actuation unit employs a 22-µm-thick TiNi SMA film that generates force through the one-way shape memory effect when heated by thermal input. The cooling unit consists of a 26.5-µm-thick TiNiFe superelastic SMA film that functions as the elastocaloric refrigerant. Heat sinks are attached to both units to enable efficient heat rejection, while a polymer coupling element transfers the actuator force directly to the refrigerant film. The two films are mounted in series on low-friction sliders guided on rails, ensuring precise longitudinal motion (Fig. 1b). Further details of device fabrication and construction are provided in the Methods and Supplementary Fig. 1.

Fig1: a, Schematic of the device, comprising a thermal actuation unit (left) and a cooling unit (right), coupled mechanically but thermally isolated. The actuator film (TiNi) is heated to cyclically load and unload the refrigerant film (TiNiFe). Movements ∆x1–3 indicate the motions of individual components: ∆x1 represents the coupled stroke between the two units, ∆x2 is the motion of the heat sink/source of the cooling unit and ∆x3 is the motion of the heat sink of the actuation unit. b, Three-dimensional rendering of the prototype, showing the actuator film, refrigerant film and heat exchangers. The actuator converts absorbed thermal energy into mechanical work that drives the cooling cycle. c, Thermomechanical behaviour of SMAs. The actuator operates via the shape memory effect (red), while the refrigerant exploits stress-induced superelasticity (blue). The dashed curves and labelled points correspond to the operation steps in d. As, austenite start temperature; Af, austenite finish temperature; Ms, martensite start temperature; Mf, martensite finish temperature. d, Schematic showing the four steps of the heat-driven elastocaloric cooling cycle. (1) Thermal input raises the actuator film temperature above Af (orange curve 1 in c), causing contraction and loading the refrigerant film, which undergoes stress-induced austenite–martensite transformation with associated heating (light blue curve 1 in c). (2) The refrigerant film contacts the heat sink of the cooling unit, releasing heat until returning to ambient temperature (both points 2 in c). (3) The actuator film cools to ambient temperature via its heat sink (orange curve 3 in c), unloading the refrigerant film, which undergoes the reverse transformation accompanied by cooling (light blue curve 3 in c). (4) The refrigerant film contacts the heat source, absorbing heat and returning to ambient temperature (both points 4 in c).

The fundamental concept of this work is to combine the shape memory effect and superelasticity of SMAs to realize thermally driven actuation for elastocaloric cooling. The red curve illustrates the one-way shape memory effect: when pre-strained in the martensitic state (temperature (T) < martensite finish temperature (Mf)), an SMA can generate an actuation force upon heating above the austenite finish temperature (Af) as it recovers its pre-set length. The blue curve represents the superelastic characteristic of an SMA with Af below room temperature. Under external loading, these materials undergo a stress-induced martensitic transformation that releases latent heat, while unloading triggers the reverse transformation that absorbs heat. This reversible process constitutes the elastocaloric effect35.

The operation cycle of the device consists of four steps. The labelled orange and light-blue dashed curves in Fig. 1c correspond to the four operating steps, illustrating the thermomechanical behaviours of the actuator (shape memory effect) and refrigerant (superelastic effect) films. Both films are initially pre-strained to enable actuation by the shape memory effect. In step 1, the thermal input raises the actuator film above its Af temperature, transforming it from martensite to austenite and generating sufficient force to elongate the refrigerant film. This loading induces a stress-driven martensitic transformation in the refrigerant, accompanied by heat release. In step 2, the heated refrigerant film contacts the heat sink of the cooling unit, where the released heat is rejected. In step 3, the actuator film is cooled to ambient temperature via its heat sink, returning to its martensitic state with reduced force. The refrigerant film then recovers to its original length through superelastic unloading, undergoing the reverse transformation and cooling below ambient temperature. In step 4, the cooled refrigerant film contacts the heat source, absorbs heat from the target region and returns to ambient temperature. Repetition of this four-step cycle transfers heat from the cold side (heat source of the cooling unit) to the hot side (heat sink of the cooling unit), thereby establishing a measurable temperature span across the device.

Solid-state cooling...With the actuator at a temperature of 86°C, the prototype achieved a temperature difference of 4°C at the component level, while the temperature change within the elastocaloric refrigerant was nearly 13°C. The system also operated reliably with an external heat source supplying 130°C, demonstrating its ability to function with real-world heat sources.

Thus, the prototype experimentally demonstrates the concept's viability for the first time.

The configuration used in the demonstration was designed as a feasibility study and is, therefore, not yet optimized for maximum cooling capacity. The team is already working on connecting multiple films in parallel to increase cooling capacity.

Potential applications range from cooling computer processors—which could utilize their own waste heat for this purpose—to cooling sensitive electronic components in automobiles by leveraging heat from the propulsion and transmission systems.

"We believe this is just the beginning," said Xu. "By scaling up this technology, we aim to develop compact cooling systems that harness abundant heat sources for sustainable cooling."

Researchers have built the first heat-driven solid-state cooling system that uses ultra-thin shape memory alloy films to convert waste heat directly into cooling without an electric motor, as published in Nature Energy by scientists from the Karlsruhe Institute of Technology (KIT) and the University of Tsukuba. This breakthrough is further documented in Nature, establishing a new way to utilize thermal energy for eco-friendly thermal management

How the system works...The prototype pairs two paper-thin, mechanically connected metal films that perform complementary tasks:

The actuator film: A 22-micrometer nickel-titanium shape memory film that acts as an internal engine. When it gets warm, it contracts sharply and turns thermal energy into mechanical pulling force

The refrigerant film: A 26.5-micrometer superelastic TiNiFe film connected to the first film. The pulling force stretches and relaxes this second film cyclically

The elastocaloric effect: Releasing the mechanical load causes a sudden shift in the metal's crystal structure, which absorbs heat and generates cold

Performance and metrics:

At 86 °C (187 °F) Joule Heating: The refrigerant film achieves a temperature span of 12.9 K, while the overall device reaches 4.0 K with a cooling power of 2.79 mW

At 130 °C (266 °F) external heat source: The system maintains a stable device-level temperature span of 2.2 K and a cooling power of 2.09 mW.

Efficiency: The tiny actuator foil generates a high force-to-displacement ratio of 14.5 N/mm, beating comparable commercial electric actuators by more than ten times

Potential applications:

Computers: Cooling high-powered processors by using their own waste heat to drive the cycle.

Automotive: Managing sensitive electronics in vehicles using leftover heat from propulsion and transmission systems.

Sustainable HVAC: Scaling up the design by connecting multiple films in parallel to replace conventional, high-emission vapor-compression systems

Karlsruhe Institute of Technology

Wednesday, September 16, 2026


TECH


The new artificial intelligence war may be decided by something other than intelligence

Historically, most technological breakthroughs do not fundamentally affect the risk of conflict. There have been notable exceptions. The invention of printing helped fuel the social and religious upheavals in Europe that later contributed to the outbreak of the Thirty Years’ War in 1618. By contrast, nuclear weapons have significantly dampened the risk of great power war since World War II.

Because advanced artificial intelligence (AI) could create far-reaching social, economic, and military disruptions, it could be another exceptional technology with important implications for international security (Kissinger, Schmidt, and Mundie 2024). Analysts need to seriously consider the possibility that AI may cause changes in the international security landscape that could lead to the outbreak of wars that would not otherwise happen (Mitre and Predd 2025).

Drawing on decades of research about what conditions make wars more or less likely throughout history, we examine six hypotheses about how AI might increase the potential for major interstate war (Van Evera 1994). The hypotheses reflect different ways that AI’s effects on militaries, economies, and societies might undermine international stability, with a focus on the pathways that appear most plausible and concerning. We evaluate these hypotheses by identifying what key conditions are needed for them to be valid and then assessing the likelihood that those conditions will align in ways that would make conflict more likely.

Exploring the consequences of advanced artificial intelligence that is much more sophisticated than what exists today, the analysis assumes that AI could eventually become capable of reliably matching human performance across a wide range of cognitive tasks, which some technologists refer to as “artificial general intelligence” (Kahl 2025).

Overall, the risk that AI will directly trigger a major war appears low, especially if governments take steps to manage the technology’s use. But AI could create destabilizing shifts in the balance of power or negatively influence human strategic judgment in ways that fuel misperceptions. Fortunately, prudent government policies can help limit these risks.

For years, the race for leadership in artificial intelligence was measured almost exclusively by one question: which company created the most powerful model? That logic remains important, but a second metric is emerging that could completely change the game. Cheaper models are achieving results close to those of the most advanced systems while operating at much higher speeds and lower costs. For those developing AI agents, this difference could be decisive.

Google highlighted this shift with Gemini 3.8 Flash, introduced as its most advanced general-purpose model to date. The tool was developed specifically for programming, multi-step reasoning, and agentic tasks—scenarios where the AI ​​must use tools, verify results, and correct its own errors.

The promotional price is $0.75 per million input tokens and $3.75 per million output tokens. This rate applies through the end of 2026, after which the prices will double the following year.

The most interesting aspect, however, emerges when price and performance are analyzed together. On Artificial Analysis’s Intelligence Index, Gemini 3.8 Flash scores 59 points in high-level reasoning, placing it close to the configurations of much more expensive models.

Its speed is also noteworthy. The system reaches approximately 327 tokens per second—more than four times the median recorded among reasoning models evaluated by the platform.

There is, however, a caveat: the new Gemini uses about 30% more output tokens than its predecessor and may make more tool calls. Consequently, while the price per token remains low, the effective cost per task has risen by about 40%.

Just when it seemed Google had found a particularly aggressive balance between price and capability, Meta unveiled Muse Spark 1.3.

The model was designed for programming and long-running tasks, particularly those requiring the management of tools, files, and multiple instructions within a single context. In the "xhigh" configuration, Muse Spark 1.3 scores 61 points on the Intelligence Index—two points higher than Gemini 3.8 Flash. The "max" variant, currently limited in availability, reaches 62 points.

The cost is also competitive: $1.25 per million input tokens and $4.25 per million output tokens. According to Artificial Analysis, each task analyzed costs approximately $0.55—slightly less than Google's model.

Meta also claims that the new system uses about 20% fewer tool calls and 25% fewer tokens than the previous generation.

This doesn't automatically make Muse Spark the best model. Gemini, for instance, boasts nearly double the generation speed. Furthermore, no single benchmark can replicate every real-world use case.

Even so, the results highlight something important: the gap between cost-effective models and cutting-edge systems is narrowing rapidly.

The shift that might unsettle OpenAI and Anthropic... This is where the competition gets interesting. For a simple query, the price difference between models might seem negligible. But autonomous agents operate differently.

An AI tasked with coding an application, analyzing hundreds of documents, or conducting extensive research might make dozens of tool calls and consume millions of tokens. In that scenario, small price differences are no longer small.

More expensive models from OpenAI and Anthropic can cost several times more per million tokens. In certain comparisons, Gemini 3.8 Flash costs up to 13 times less per token while maintaining performance levels relatively close to the competition in some evaluations.

This doesn't mean Google or Meta have definitively overtaken the leaders in artificial intelligence. That isn't the point.

To compete, they may not even need to create the smartest model on the planet. It is enough to offer an AI capable of performing nearly the same tasks, with sufficient speed and at a fraction of the price.

In the era of autonomous agents, that detail could be huge. A difference of just a few points on a benchmark may matter less than the number of tasks a company can execute within the same budget.

The next great battle in artificial intelligence, therefore, may not be decided solely by who has the smartest model. The winner could be the one that delivers enough intelligence to get the job done—while spending far less to do so.

mundophone

 

TECH


Machine learning tool could speed up fire safety assessments for steel beams

The numerous advantages of steel in construction, such as strength-to-weight ratio, ease of construction, etc., have made steel structures widely used in various industries. However, when compared to concrete, in the case of fire incidence, steel beams can experience significant deformation, compromising their structural integrity and posing serious risks to life and property. For this reason, an efficient approach to measuring and evaluating the deformation of steel beams when subjected to fire is essential for accurately quantifying fire-induced damage, which will consequently facilitate efficient decision-making (process). Historical fire incidents around the world, such as the World Trade Center (2001) and the Grenfell Tower (2017) have underscored the vulnerability of steel structures to fire. According to a statistical report on fire accidents around the world, over seven million fire accidents took place all over the world causing about seventy thousand casualties. With the increase of structural fire knowledge, considerations for fire resistance are incorporated into standards. 

These considerations are traditionally based on standard experiments conducted on individual structural members subjected to predetermined boundary conditions and structural loading. This practice, despite being accepted by engineering practitioners and academicians, has certain limitations. A typical example is the seven large-scale fire tests (BS 8414‐1) commissioned by the UK government following the Grenfell event to determine the combinations of insulation and aluminium composite material (ACM) cladding that could be safely used. According to the method, it is required that the test be stopped when flames are observed higher than the test. 

Thus, this method cannot be used to examine all façade fire scenarios. The common practice is to perform these tests on an individual-member level, which, in addition to the inability to capture real fire scenarios and neglecting the mechanical influence of the other structural members, is also expensive and time-consuming. While BS 8414-1 cannot (economically) simulate the wide range of real-world fire propagation scenarios or predict structural behavior beyond visual flame spread, the proposed ML-based regression approach addresses this limitation by learning from comprehensive fire test data to predict continuous deformation patterns across diverse fire exposure conditions. Furthermore, empirical formulas derived from experimental results typically consider the temperature distribution along the beam's cross-section and use simplified assumptions to estimate the resulting deformations. However, these formulas often lack accuracy and fail to capture the complex behaviour of steel subjected to high temperatures. 

They also assume uniform heating across the beam, which is not representative of real fire scenarios. As a result, empirical formulas may lead to significant deviations in predicting the actual fire-induced deformations. Hence, numerical simulation is considered a useful tool to investigate, understand, and analyse such fires, and, of particular use, specific phenomena can be isolated and evaluated more easily in a mathematical and cost-effective way. Several studies have shown the feasibility and usefulness of numerical simulation for high-rise building fires. The application of computational fluid dynamics and fire dynamics simulator for numerical simulations entails a deeper analysis of the fire propagation pattern in the World Trade Centre after the incident. In addition to employing standard fire curves, some researchers successfully adapt multiple fire models to simulate complicated fire scenarios in more accurately and effectively. 

While these methods have provided valuable insights into the fire-induced deformation of steel beams, they have certain limitations. Some of the limitations include the complexity of developing a comprehensive model, which also requires advanced knowledge in mathematics as well as mechanics. They often rely on simplifying assumptions and may not accurately capture the intricate behaviour of steel under fire conditions. Additionally, traditional methods can be time-consuming, computationally expensive, and require significant expertise to implement.

Researchers at The University of Manchester, Shandong Jiaotong University and Harbin Engineering University have developed a machine learning framework, enabling rapid prediction of how protected steel beams respond during a fire, offering engineers a faster way to assess fire safety performance in industrial structures.

The study, published in the KSCE Journal of Civil Engineering, focuses on three-sided protected steel beams, a configuration commonly used in offshore and onshore oil and gas processing facilities. In these structures, the upper surface of the beam remains exposed, creating complex temperature patterns that can be difficult to model accurately.

Understanding how heat moves through these beams during a fire is an important part of structural fire engineering. However, temperature distribution is influenced by several interacting factors, including beam depth, insulation thickness and material conductivity, making conventional analytical equations challenging to apply across different scenarios.

To address this challenge, the researchers created an automated workflow that links computer modelling, simulation and data processing. The system combines Python, ABAQUS and MATLAB with machine learning techniques to automatically generate models, run simulations and train predictive algorithms.

The team generated a database containing 414 standard beam models and 63 welded beam models, covering beam depths ranging from 127 mm to 1500 mm and a variety of insulation configurations. These data were then used to train machine learning models capable of predicting beam temperatures during fire exposure.

Current fire engineering assessments often rely on detailed numerical simulations, which require significant time and computing resources, while analytical equations are limited in accuracy by the number of parameters. Our framework demonstrates how machine learning can be combined with automated modelling techniques to deliver accurate temperature predictions much more efficiently. This could support the evaluation of fire protection systems across a wide range of steel beam configurations„...Dr Yang Li, Department of Civil Engineering and Management

The researchers found that the best-performing approach, based on gradient boosting, achieved a root mean squared error of just 1.34°C when compared with test data. More than 83% of prediction calculations were completed within 60 seconds, demonstrating the potential for rapid assessment of fire protection requirements.

The study also introduced a model generation agent incorporating a two-dimensional contact detection algorithm, enabling the automatic creation of beam heat transfer models. A dedicated data processing pipeline and batch-generation system were developed to support large-scale training while reducing memory requirements, allowing the work to be carried out using a single graphics processing unit.

According to the researchers, the approach could help engineers evaluate insulation strategies and fire protection requirements more efficiently, particularly in sectors where structural fire performance is a key design consideration. By reducing the need for repeated complex simulations, the framework has the potential to support faster decision-making during engineering design and assessment.

The research was conducted by Yang Li and Peijun Wang et al. The paper lists the Department of Civil Engineering and Management of The University of Manchester and Shandong University, as the authors' institutional affiliation.

The new artificial intelligence tool developed by researchers at the University of Manchester, in collaboration with Shandong Jiaotong University and Harbin Engineering University, promises to revolutionize and drastically accelerate fire safety assessments for protected steel beams. The model replaces lengthy, complex physical simulations with heat transfer predictions in record time.

The model's technical impact... Traditionally, engineers rely on expensive practical tests or Finite Element Analysis (FEA) simulations that require high computing power and hours of processing time. The machine learning-based approach overcomes these barriers with impressive results.

Remarkable speed: Over 83% of prediction calculations were completed in less than 60 seconds.

Surgical precision: The most efficient technique, based on gradient boosting, achieved a root mean square error (RMSE) of just 1.34°C compared to actual experimental data.

Accessible hardware: Thanks to a dedicated data processing and batch generation pipeline, memory requirements were drastically and efficiently reduced, allowing the entire large-scale training process to run on a single graphics processing unit (GPU).

Thermal model automation... In addition to predicting the failure temperatures of metal alloys, the study introduced an intelligent model-generating agent that incorporates a two-dimensional contact detection algorithm. This means the AI ​​itself can automatically create heat transfer models for the beams, enabling engineers to rapidly test a wide range of thermal insulation thicknesses and passive fire protection strategies.

This technology optimizes decision-making during the early stages of civil engineering projects, ensuring structurally safer buildings without inflating costs through endless simulations.

The University of Manchester

Tuesday, September 15, 2026


TECH


Fujitsu introduced microscopic defects into diamonds to create a new type of quantum computer

Forget traditional quantum chips for a moment. Fujitsu has just unveiled a prototype that uses diamonds, tin atoms, and light particles to tackle one of quantum computing's biggest hurdles: scaling up machine size without losing control of the qubits. While it still requires operating temperatures of an impressive -271.6°C, it features a characteristic that could completely transform how quantum computers are built.

The new computer developed by Fujitsu employs an approach known as "diamond spin."

This doesn't simply mean swapping silicon for a gemstone.

Researchers work with synthetic diamonds containing microscopic defects carefully engineered into their crystal structure. The prototype utilizes tin-vacancy centers, known by the acronym SnV.

In these centers, a tin atom occupies a position between two vacancies within the diamond's structure. These tiny defects allow for the creation and control of quantum states that function as qubits.

Similar systems traditionally use nitrogen-based NV centers. Fujitsu opted for tin because its structure offers greater symmetry and is less susceptible to certain types of external noise.

SnV centers can also emit light with an intensity roughly ten times greater than the conventional approach—an advantage that is particularly appealing given the company's future plans.

However, there is a detail that prevents any conclusion that Fujitsu has solved the issue of extreme temperatures in quantum computing.

The prototype operates at approximately -271.6°C, or about 1.55 Kelvin.

That is just a few degrees above absolute zero.

Even so, it is a higher temperature than the benchmark of approximately -273.13°C cited by Fujitsu for superconducting quantum computers.

Therefore, this new development is not a room-temperature quantum computer.

Far from it. The great promise lies in another feature: the modules can be connected using light.

And this aims to solve a fundamental problem.

Building a few qubits is one thing. Creating thousands or millions of them that work reliably within the same system is far more complex.

Instead of trying to fit everything into a single, gigantic structure, Fujitsu is betting on smaller modules that can be interconnected.

Light can transform small modules into a massive machine...The architecture uses photons to establish quantum connections between modules.

These links can occur between qubits located on different chips and even between systems housed in separate cryogenic units.

To make this possible, Fujitsu developed photonic circuits that combine nanometric diamond structures with alumina optical waveguides capable of carrying the light emitted by SnV centers.

It is like building a giant computer by assembling smaller parts, but using the quantum properties of light to enable them to work together.

This modular strategy could greatly facilitate future expansion.

Fujitsu and the QuTech institute at Delft University of Technology have previously demonstrated operations involving entanglement and quantum gates between NV centers housed in separate cryogenic units.

Now, the company aims to scale this concept up to a much larger architecture.

The 1,000-qubit milestone is still a few years away...This is where an important detail comes in. The computer unveiled now does not feature 1,000 logical qubits.

That figure is part of Fujitsu's technology roadmap.

The company plans to unveil a multi-module diamond-spin computer prototype in 2027. Subsequently, its goal is to achieve a system with 250 logical qubits in the 2030 fiscal year and reach 1,000 logical qubits in the 2035 fiscal year.

The word "logical" is also significant.

Physical qubits are extremely sensitive to noise and errors. Therefore, fault-tolerant quantum computers must combine multiple physical qubits to produce more reliable logical qubits. The hope is that the characteristics of diamond spins will allow for the formation of these logical qubits using fewer physical qubits than some competing approaches.

Fujitsu does not intend to abandon superconducting quantum computers.

Quite the opposite.

The company plans to develop technologies capable of integrating diamond-based systems with superconducting machines, leveraging the advantages of different architectures.

The current prototype has also already been operated in a test environment using the company's hybrid quantum computing platform.

There is still a vast gap between demonstrating a prototype and building a fault-tolerant quantum machine capable of solving commercially relevant problems.

But the experiment points to a possible way to overcome a fundamental obstacle: how to keep adding qubits without turning the computer into an uncontrollable structure.

Fujitsu's answer may lie in a rather unlikely combination.

Tiny defects within diamonds create the qubits. And particles of light may be responsible for linking them all together.

Comment from Vivek Mahajan, Corporate Executive Officer, Corporate Vice President, CTO, in charge of System Platform, Fujitsu Limited

"The diamond-spin approach we have applied in this prototype not only offers exceptional scalability in its own right, but also has the potential to be integrated with superconducting quantum computers to further extend their capabilities, enabling more complex and large-scale computations.

Under our roadmap to achieve a 250 logical qubit system by fiscal 2030 and a 1,000 logical qubit system by fiscal 2035, Fujitsu will continue advancing practical quantum computing across a broad range of areas, from software to hardware, while leveraging the key advantages of the diamond-spin approach, including high fidelity and optical connectivity."

Comment from Dr. Kees Eijkel, General Director, QuTech, Delft University of Technology...“We are delighted to announce this prototype diamond spin quantum computer as a result of the collaborative research conducted since 2020 between Fujitsu, Delft University of Technology, and QuTech. It is a major milestone in our strong collaboration. Demonstrating the scalability expected of diamond spin quantum computing remains a long and challenging journey. However, by further strengthening our collaboration with Fujitsu, we are committed to tackling this ambitious and meaningful challenge and leading the development of next-generation quantum technologies.”

Overview of developed technologies...The prototype features these three technologies developed by Fujitsu:

Heterogeneous material bonding and thinning technology for scalable quantum computing chips...To create quantum computing chips using SnV centers, Fujitsu developed heterogeneous material bonding technology to bond high-quality diamond substrates ion-implanted with tin to alumina/silicon dioxide substrates. Fujitsu also developed thinning technology to reduce the thickness of diamond substrates from several hundred micrometers to several hundred nanometers, making them suitable for use in quantum computing chips.

Photonics-integrated circuit fabrication technology for SnV centers...Fujitsu developed technology to fabricate photonics integrated circuits [3] that integrate nanometer-sized diamond crystals containing SnV centers with alumina optical waveguides, which are transparent in the visible light region, to extract single photons emitted from SnV centers during qubit readout. For diamond processing, Fujitsu utilized the results of joint research with The University of Tokyo.

Quantum circuit conversion technology for diamond spin approach...The diamond-spin approach requires qubit control by combining light, microwaves, and radio frequency waves. Fujitsu developed a mechanism to convert quantum circuits described by quantum gates into control sequence for these physical operations for the diamond spin approach, enabling control from the Fujitsu’s hybrid quantum computing platform.

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