TECH
Ultra-thin MoS₂ computer packs 1,400 transistors onto one chip
The rapid advancement and diffusion of artificial intelligence (AI) systems, such as the machine learning models underpinning the functioning of ChatGPT, Gemini and similar platforms, have posed new demands on the electronics engineering industry. In fact, these systems are computationally intensive and consume substantial power, particularly when running on existing devices.
Electronics engineers worldwide have thus been trying to develop new hardware systems that can run machine learning algorithms more energy efficiently, without adversely affecting their performance. One promising approach for reducing power consumption entails the use of two-dimensional (2D) semiconductors, ultrathin materials that have already proved promising for the development of smaller electronics.
Researchers at Nanjing University, Suzhou Laboratory and Huawei Technologies Co. Ltd. recently developed and fabricated a fully functional computer based on the 2D semiconductor molybdenum disulfide (MoS₂).
This computer, presented in a Nature Electronics paper, combines more than 1,400 tiny transistors (i.e., devices that amplify and switch electrical signals) on a single chip.
"This research grew from our recognition of 2D semiconductors' transformative potential," Yun Mao, co-first author of the paper, told BBC.
"As silicon transistor scaling nears its fundamental physical limits, 2D semiconductors have emerged as one of the most promising materials for the post-Moore era: Their atomic thickness suppresses the short-channel effects that cripple ultrascaled silicon, enabling further miniaturization beyond what silicon can achieve."
Silicon rival MoS2 promises small, low-energy chips...The first computer chip made out of a substance described as a "promising" alternative to silicon has been tested by researchers.
The Switzerland-based team used molybdenite (MoS2) - a dark-coloured, naturally occurring mineral.
The group said the substance could be used in thinner layers than silicon, which is currently the most commonly used component in electronics.
It said MoS2 could make smaller, more flexible chips that used less energy.
The substance is currently used as an ingredient in engine lubricants, ski waxes and as a strengthening agent for plastics.
Prof Andras Kis, the director of the Laboratory of Nanoscale Electronics and Structures (LANES) in Lausanne, publisheddetails of the research, externalin the latest edition of the ACS Nano journal.
He said the team chose to experiment with this semiconductor, rather than another material, in part because it was easily available.
"There is something like 19 million metric tonnes around," Prof Kis told the BBC.
Surfaces oxidise...To obtain a thin layer of the material to work with, Prof Kis's team put a strip of sticky plastic over the crystal, peeled it off and then attached the sliver to a support. The plastic was then peeled off to leave the very thin layer of MoS2 exposed.
Using this, the team built a prototype microchip circuit to which they attached up to six serial transistors allowing them to carry out simple logic operations.
Although the integrated circuit was basic, Prof Kis said it proved that more complex designs would be possible on thinner chips than could be produced with silicon.
"The problem with silicon is that you cannot make very thin things from it because it is very reactive," he said.
"The surface likes to oxidise - it likes to bind with oxygen... and that makes its electrical properties degrade when you want to make a very thin film."
As a result the thinnest usable layers of silicon used in computer chips have been around two nanometres thick. MoS2, by contrast, can be used in layers just three atoms thick, allowing chips to be made at least three times smaller.
MAGIC-1000 chip wafer. Credit: Fan et alFrom individual 2D devices to a fully functional computer...While 2D semiconductors have proved to be promising for the development of miniaturized and ultrathin electronics, most earlier works used them to fabricate individual components or small circuits. In addition, the few larger-scale demonstrations of 2D semiconductor-based systems integrated only a limited number of transistors and components.
Mao and his colleagues set out to fill this gap in the literature and realize a fully functional, large-scale computer based on a 2D semiconductor. The computer they developed is among the first to integrate more than 1,000 MoS₂-based transistors on a single chip.
"We recognized that proving 2D materials' viability for ultra-large-scale integration required a complete, end-to-end approach addressing key challenges across fabrication, standard cells, logic synthesis, and interconnect routing," said Mao.
"Our core objective was thus to develop a Multi-Level Co-Optimization (MLCO) methodology and demonstrate a thousand-transistor-scale computer, proving 2D semiconductors can transition from lab curiosities to practical applications."
The computer developed by this research team essentially operates as a tiny parallel data-processing factory. The computer has a 4-bit parallel processor that can execute eight different instructions and has four core modules. Its modules include an instruction decoder, a register file, an arithmetic logic unit and a multiplexer.
"The decoder translates incoming instructions into chip-readable signals, which direct the register file to fetch data, the ALU to perform arithmetic operations, and the multiplexer to write results back to registers," explained Mao.
"Unlike prior 2D chips limited to serial 1-bit processing, our 4-bit design handles four bits simultaneously, drastically improving speed."
Using their newly introduced MLCO design strategy, the researchers were able to integrate significantly more transistors into a single chip compared with earlier microprocessors based on materials other than silicon. Specifically, they achieved a density of 9,336 transistors per square millimeter, which is comparable to transistor densities in silicon-based devices.
"We also demonstrated the first multi-bit parallel 2D semiconductor computer, a departure from all prior serial implementations," said Mao.
"Finally, we achieved the first on-chip register file integration in 2D technology, eliminating the performance bottleneck of off-chip storage required by all previous 2D computer systems."
A blueprint for developing ultrathin and energy-efficient computers
This recent study opens new exciting possibilities for the fabrication of new energy-efficient and ultrathin computers based on MoS₂ or other 2D semiconductors. The team's proposed methodology could soon be refined further and applied to the realization of other similar computers.
"We have established a clear Lab-to-Fab technology path, providing a foundational paradigm for future 2D integrated circuit development," said Mao.
"In addition, we will explore heterogeneous integration of 2D materials with mature silicon technology, combining their complementary strengths to build more powerful and efficient next-generation integrated circuits."
by Ingrid Fadelli


